Principal 5G RF Module Design Engineer/RF Package Design Lead
San Diego, CA, USA | Qualcomm Incorporated
Telecommunications & Wireless
Functions:IT / Information Technology
Design / Graphic Design
Job Description:80 people have viewed this job
Qualcomm is a company of inventors that unlocked 5G ushering in an age of rapid acceleration in connectivity and new possibilities that will transform industries, create jobs, and enrich lives. But this is just the beginning. It takes inventive minds with diverse skills, backgrounds, and cultures to transform 5Gs potential into world-changing technologies and products. This is the Invention Age and this is where you come in.
Partner with the IC teams product engineering , test teams through the product development lifecycle; taking a IC concept and transforming it into a manufacturable and scalable 5G (front-end + transceiver ) module
Design, implement, and institutionalize processes and procedures for 5G modules
Propose and define strategy for different 5G transceiver- RF front module design options optimizing for cost/form-factor and performance
Partner and collaborate with internal RF front-end teams and Module teams
Design/release and partner with test teams to perform module in the lab and compare performance against discrete parts
Be the senior technical leader and systems-level voice across Qualcomm's Operations, Engineering, and Executive teams; acting as a strong partner and influencer to ensure the best package/model technologies and products are developed and taken to market.
Overall manage and lead the RF-IC packaging and modeling team spread across geographies
Responsible for owning the packaging roadmap and partner with IC teams to define tools/ industry survey to select best package technologies
Own the execution from concept to bring-up in the lab of the package design.
All Qualcomm employees are expected to actively support diversity on their teams, and in the Company.
Bachelor's degree in Engineering, Information Systems, Computer Science, or related field.
8+ years Hardware Engineering experience or related work experience.
Strong leadership, expert influencer, management communication, and presentation skills with experience maintaining relationships with internal customers at an executive level.
Minimum of 10 years of management experience in cross-matrix, technology organizations focused in/around RF package/module/PCB /system design
Direct people management experience across geographies
Phone / PCB system design experience for RF /connectivity
Education Requirements Preferred Masters/Doctorate