Principal 5G RF Module Design Engineer/RF Package Design Lead

San Diego, CA, USA | Qualcomm Incorporated

  • Industry:
    Information Technologies
    Telecommunications & Wireless
  • Position Type:
  • Functions:
    IT / Information Technology
    Product Development
    Design / Graphic Design
  • Experience:
    7-10 years
Job Description:
80 people have viewed this job

Qualcomm is a company of inventors that unlocked 5G ushering in an age of rapid acceleration in connectivity and new possibilities that will transform industries, create jobs, and enrich lives. But this is just the beginning. It takes inventive minds with diverse skills, backgrounds, and cultures to transform 5Gs potential into world-changing technologies and products. This is the Invention Age and this is where you come in.


Partner with the IC teams product engineering , test teams through the product development lifecycle; taking a IC concept and transforming it into a manufacturable and scalable 5G (front-end + transceiver ) module


Design, implement, and institutionalize processes and procedures for 5G modules


Propose and define strategy for different 5G transceiver- RF front module design options optimizing for cost/form-factor and performance


Partner and collaborate with internal RF front-end teams and Module teams


Design/release and partner with test teams to perform module in the lab and compare performance against discrete parts


Be the senior technical leader and systems-level voice across Qualcomm's Operations, Engineering, and Executive teams; acting as a strong partner and influencer to ensure the best package/model technologies and products are developed and taken to market.


Overall manage and lead the RF-IC packaging and modeling team spread across geographies


Responsible for owning the packaging roadmap and partner with IC teams to define tools/ industry survey to select best package technologies


Own the execution from concept to bring-up in the lab of the package design.


All Qualcomm employees are expected to actively support diversity on their teams, and in the Company.


Minimum Qualifications


Bachelor's degree in Engineering, Information Systems, Computer Science, or related field.


8+ years Hardware Engineering experience or related work experience.


Preferred Qualifications


Strong leadership, expert influencer, management communication, and presentation skills with experience maintaining relationships with internal customers at an executive level.


Minimum of 10 years of management experience in cross-matrix, technology organizations focused in/around RF package/module/PCB /system design


Direct people management experience across geographies


Phone / PCB system design experience for RF /connectivity


Education Requirements Preferred Masters/Doctorate